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Tutorial
In addition to the conference, three technical Tutorials will take place on Wednesday, April 28 in the morning.
The Tutorial is organized by Prof. Dr. Johann W. Bartha, University of Dresden.
8:30 - 9:00 |
Tutorial Registration |
9:00 - 12:10 |
Tutorial 1:
"General Introduction of APC"
Presenter:
James Moyne (Applied Materials / University of Michigan)
Martin Schellenberger (Fraunhofer Institute IISB)
Francesco Rametta (STM)
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Tutorial 2:
"Sensors Implementation & Data Analysis for APC Application in Plasma Etch"
Presenter:
Bryan Helmer
(Lam Research)
Daniele Lavalle (Techno Fittings)
Giuseppe DeNicolao (Univ. of Pavia)
Carlo Bevilacqua
(Numonyx) |
Tutorial 3:
"From the Lab to the Fab"
Presenter:
Alain C. Diebold
(University at Albany)
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| Tutorial 1: "General Introduction of APC" |
| Outline |
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The Tutorial discusses advanced process control approaches to gain higher manufacturing flexibility on a factory-wide level, driven by the need to increased product mix, cost-pressure and technology complexity.
Different disciplines are integrated to a comprehensive picture. Learn about data collection, the integration of process control data and quality control data, integration between model tuning and model adoption, abstraction of the manufacturing process, prediction techniques and much more. |
| Presenter |
James Moyne
(Univ. of Michigan) |
James Moyne is a Standards and Technology Specialist for Applied Material's Applied Global Services Division.
He received his B.S.E.E. and B.S.E. - Mathematics, and his M.S.E.E. and Ph.D. degrees from the University of Michigan, where he is currently an Associate Research Scientist in the Department of Electrical Engineering and Computer Science.
Dr. Moyne was president and co-founder of MiTeX Solutions, Inc., established in 1995 to provide configurable run-to-run control solutions for semiconductor and display manufacturing; MiTeX Solutions was purchased by Brooks Automation in 2000, the software division of which was purchased by Applied Materials in 2007.
Dr. Moyne has experience in advanced process control, database technology, and sensor bus technology, and is the author of a number of many refereed publications in each of these areas. He is co-author of Run-to-run Control in Semiconductor Manufacturing. He is also the author of a number of SEMI standards in the areas of process control, sensor bus, and communications, and currently co-chairs process control systems and sensor bus standards efforts.
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Martin Schellenberger
(FhG IISB) |
Martin Schellenberger received his diploma in Electrical Engineering in 1998 from the University of Erlangen-Nuremberg, Germany. He joined the department of Semiconductor Manufacturing Equipment and Methods at the Fraunhofer Institute of Integrated Circuits and Device Technology (IISB) in 1998.
In his role as Group Manager for Equipment and Advanced Process Control he is responsible for the development of solutions for integrated metrology and their link to advanced process control systems.
He is active in the fields of software architectures for the integration of metrology and sensors, interfaces and protocols for equipment communication in semiconductor manufacturing, internet communication and e-Diagnostics as well as cluster processing for new materials
Martin can be reached at martin.schellenberger(at)iisb.fraunhofer.de. |
Francesco Rametta
(STM)
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Francesco Rametta received a degree in chemistry in 1998 at Catania University and has been working in STMicroelectronics since 1999.
Until 2002, he was owner of qualification and industrialization of new lithography tools, processes and procedures. Afterwards, he joined the APC group following the development of R2R in etch area and the deployment of MAESTRIA in various process areas of CTM8 and CTM6.
Currently, he is the scientific coordinator for ST Italy inside the IMPROVE project. |
| Tutorial 2: Sensors Implementation & Data Analysis for APC Application in Plasma Etch |
| Part 1: "Process monitoring and fault detection on a plasma etch system" |
| Outline |
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This first part of the tutorial will introduce a plasma etch system used in the semiconductor industry. For this plasma etch system, the currently-available on-board sensors and data collection will be described, including a discussion of the data sample rates, the characteristics of the data channels, file management, and communications. Both uni-variarate and multivariate methods are currently used for fault detection, scheduling of preventive maintenance, R2R and Virtual Metrology.
To conclude, we will discuss the future needs for additional sensors and data analysis techniques |
| Presenter |
Bryan Helmer
(Lam Research srl, Agrate-Brianza, Milan, Italy
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Bryan Andrew Helmer obtained a B.S.E degree in Chemical Engineering in 1993 from Princeton University, with a thesis: "The dynamic behavior of an adaptive process control system".
In 1998 he completed a Ph.D degree in Chemical Engineering from the University of California at Berkeley, with a thesis: "Computer simulations of plasma-surface chemistry".
From 1998 to 2004 he worked at Lam Research Corporation in California as a Senior Development Process Engineer on Plasma Dielectric Etch Systems.
Since 2004 he works at Lam Research s.r.l. in Italy as a Senior Field Process Engineer.
He can be reached at Bryan.Helmer(at)amrc.com
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| Part 2: "SensorNetwork: design and needs" |
| Outline |
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It is extremely important to implement what is called "sensor integration" in order to improve the monitoring equipment/process and its environment (all parts outside the equipment but important for equipment/process results) as for vacuum pumps and exhaust.The sensor integration allows interfacing with sensors, signals and in general with any system to monitor equipment and/or process stability.
In this section will be shown various aspects related to sensor integration (communication, data transfer, data storage...), taking in consideration the case of a single equipment, related to fabwide and advanced methodologies (Virtual Metrology and Predictive Maintenance) needs. |
| Presenter |
Daniele Lavalle
(Techno Fittings s.r.l. Rome – Italy) |
Daniele Lavalle
R & D Engineer - Graduated in electronic engineering.
Previous experiences:
C.I.S.A. sud: R & D Industrial Security Systems
Freelancer Firmware developer
In Techno Fittings Daniele is the manager for all R&D activities of our products. He gained experiences working on several DAQ project for SEMI environment as Sensor Connectivity project, Dry Pump data collection, sensor protocol analysis for fast data acquisition.
He can be reached at lavalle.daniele(at)technofittings.com
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| Part 3: "Data analysis for plasma etch APC" |
| Outline |
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Data analysis for APC: implemented methods and their limitations with reference to plasma etch. Modeling needs in APC.
Strengths and drawbacks of modeling approaches: white-, grey- and black-box techniques; extracting information from data using data-mining and statistical methods.
Threshold setting based on statistical decision theory. Application to plasma etch and future developments. |
| Presenter |
Giuseppe DeNicolao (University of Pavia) |
Giuseppe De Nicolao received the Laurea (master degree) in Electronic Engineering from the Polytechnic of Milan, Italy, in 1986.
From 1987 to 1992 he performed reasearch with the Institute of Pharmacological Researches "Mario Negri", Milan, and the Italian National Research Council (C.N.R.).
In 1992 he joined the Department of Computer Science and Systems Engineering of the University of Pavia (Italy), were he is currently Full Professor of Model Identification and Data Analysis.
He has been Associate Editor of the IEEE Transactions on Automatic Control and, since 2007, Associate Editor of Automatica.
His current research interests include Bayesian learning, neural networks, modeling and identification of biomedical systems, statistical process control and fault diagnosis for semiconductor manufacturing.
On these subjects he has authored or coauthored more than 90 papers appeared in peer-reviewed journals.
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Carlo Bevilacqua
(Numonyx)
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Carlo Bevilacqua received the Laurea in Plasma Physics in 1999 from the Universita’ degli Studi of Milan.
After one year of INFM contract working on magnetically confined plasma, he joined ST Microelectronics (R2) in june 2000, where he worked for 6 year as process engineer in dry etching area, with particular attention to conductor etch processes. He was group leader of production engineer conductor group for 3 years.
Since 2006 he is in charge of APC and FDC activities in dry etching area; he is involved in the project of deployment of advanced diagnostic tools for process control, with particular interest in integration between production tools and software.
In 2008 he joined Numonyx as APC Manager for dry etching. |
| Tutorial 3: "From the Lab to the Fab" |
| Outline |
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This topic covers two basic concepts. One is how lab measurements and fab measurements are complementary. The second concept is that most in-line fab metrology started as a lab based measurement method.The tutorial will cover the following:
In-line Measurements that started in the Lab
- Ellipsoemtry and Spectroscopic Ellipsometry
- Total Reflection X-Ray Fluorescence
- X-Ray Reflectivity
- Profilometry
- SEM
How lab and fab measurements complement each other.
- Variable Angle Spectroscopic Ellipsometry and in-line Spectroscopic Ellipsometry
- TEM and film thickness
- other |
| Presenter |
Alain C. Diebold
(University at Albany) |
Dr. Alain Charles Diebold is an Empire Innovation Professor of Nanoscale Science at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, as well as the Executive Director of CNSE’s Center for Nanoscale Metrology. He recently became Executive Director of the New York Center for National Competitiveness in Nanoscale Characterization.
His research focuses on the impact of nanoscale dimensions on the physical properties of materials; he also continues to work in the area of nanoelectronics metrology.
He is a member of the International Metrology Technical Working Group, founder and co-chair of the U.S. Metrology Technical Working Group for the 2008 International Technology Roadmap for Semiconductors, and chair of the Manufacturing Science and Technology Group of the American Vacuum Society. Previously,
Dr. Diebold was a SEMATECH Senior Fellow, with the main focus of his activities involving metrology industry coordination.
He has edited the Handbook of Silicon Semiconductor Metrology, published in June 2001; is a panel member for the Metrology section of Future Fab International; and, he has co-edited three books that are conference proceedings from Characterization and Metrology for ULSI Technology and its predecessor conference.
He also worked at Allied Signal in the areas of molecular beam epitaxy of III-V compounds and materials characterization of a broad range of semiconductor and amorphous metal products.
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Contact
Gitta Haupold
haupold(at)aecapc-europe.com
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