8:30 - 9:00 |
Registration for Tutorials |
| 9:00 - 12:10 |
Tutorials, Registration ongoing |
| 12:10 - 13:30 |
Lunch Break, Registration ongoing |
| 13:30 - 14:55 |
Opening Session |
| 13:30 - 13:45 |
O1 |
Opening Address |
|
| 13:45 - 14:05 |
W1 |
Welcome Address:
Raffaele Stancanelli
(Catania City Mayor) |
|
| 14:05 - 14:20 |
W2 |
Welcome Address:
|
|
| 14:20 - 14:55 |
K1 |
Keynote 1:
Orio Bellazza
(STMicroelectronics, Executive Vice President - Front End)
|
|
14:55 - 17:00 |
Session 1: Equipment and Process Fault Detection, Classification and Prediction
Session Chair: Giuseppe Vento (STMicroelectronics) |
14:55 - 15:20 |
1.1 |
Michael Muendner
(LFoundry GmbH) |
FDC-Application with 1kHz sampling rate: Detection of abnormal Plasma Discharge during an Oxide Etching Process |
| 15:20 - 15:45 |
Break |
| 15:45 - 16:10 |
1.2 |
Antonio Bonanno
(STMicroelectronics) |
FDC Application to Process Equipment Pumps |
| 16:10 - 16:35 |
1.3 |
Michael Shifrin
(Numonyx) |
In-line Metrology Equipment Early Fault Detection |
| 16:35 - 17:00 |
1.4 |
Lutz Eichhorn
(Plasmetrex) |
Quality Management by Advanced Process Control in Large Area PECVD |
| 17:00 - 17:25 |
Session 2: Data Management and Process Control
Session Chair: Almuth Behrisch (Infineon) |
| 17:00 - 17:25 |
2.1 |
Tatiana Levin
(Numonyx) |
Litho Scatterometry APC: dose control optimization when resist line profile depends on previous layers stack |
17:25 - 18:05 |
Poster and Exhibits Call
and Closing Remarks |
| 18:05 - 21:30 |
Reception, Poster Session and Exhibits |
| 9:00 - 9:05 |
Opening Remarks |
| 9:05 - 9:40 |
K2 |
Keynote 2: |
|
9:40 - 11:15 |
Session 2 ongoing: Data Management and Process Control
Session Chair: Almuth Behrisch (Infineon) |
9:40 - 10:05 |
2.2 |
Eitan Nadav
(TowerJazz Semiconductor) |
Improvement of Device Performances using R2R Poly to LDD Implant |
| 10:05 - 10:30 |
2.3 |
Cristina De Luca
(Infineon) |
Feasibility study for a Run-to-Run controller in a vapor phase epitaxy process |
| 10:30 - 10:55 |
2.4 |
Eckhard Schöbel
(AIS) |
Development of an APC-Lib for the photovoltaic industry |
| 10:55 - 11:15 |
Break |
| 11:15 - 12:30 |
Session 6: Academia Contributions, Future Needs and Opportunities
Session Gerhard Spitzlsperger (Renesas) |
| 11:15 - 11:40 |
6.1 |
Norbert Lang
(INP Greifswald)
|
Quantum cascade laser absorption spectroscopy for in situ process control in plasma etch processes |
| 11:40 - 12:05 |
6.2 |
Roberto Lojacono
(University of Rome) |
Outliers Elimination by Reverse Approximation |
| 12:05 - 12:30 |
6.3 |
Antonino La Magna
(CNR–IMM) |
Role of the atomic scale simulations in the virtual metrology of plasma processes |
| 12:30 - 13:45 |
Lunch Break |
| 13:45 - 16:40 |
Session 3: Metrology and Analytics
Session Chair: Jan Raebiger (GLOBALFOUNDRIES) |
| 13:45 - 14:10 |
3.1 |
James Moyne
(Applied Materials) |
A Process for Developing Practical Adaptive Virtual Metrology Models, and Application to a CVD Process |
| 14:10 - 14:35 |
3.2 |
Kenji Tamaki
(Hitachi) |
Practical Configuration of Virtual Metrology for Cu-CMP Process Control |
| 14:35 - 15:00 |
3.3 |
Dietmar Gleispach
(Austriamicrosystems)
Jerome Besnard (PDF Solutions) |
Metrology Models for Predicting CVD Oxide Thickness of PECVD Process |
| 15:00 - 15:25 |
3.4 |
Ariane Ferreira
(Ecole des Mines de Sainte Etienne CMP) |
Virtual Metrology Models for Predicting Overlay of Photolithography Process |
| 15:25 - 15:50 |
Break |
| 15:50 - 16:15 |
3.5 |
Emanuele Ragnoli
(NUIM) |
A Multiple Modelling Approach to a Virtual Metrology Case Study using OES |
| 16:15 - 16:40 |
3.6 |
Niall Macgearailt
(Intel) |
Metrology aware fault detection and process diagnostics |
| 16:40 - 17:45 |
Panel Discussion "Metrology and Analytics"
Closing Remarks |
17:45 - 18:05 |
Break |
| 18:05 - 19:00 |
Bus transfer to dinner |
| 19:00 - 21:30 |
Conference dinner |
| 21:30 |
Bus transfer back from dinner |
| 9:00 - 9:05 |
Opening Remarks |
9:05 - 9:40 |
K.3 |
Keynote 3
Georg Kelm
(Head of Sector Nanoelectronics at European Commission) |
Semiconductor Manufacturing in Europe - Quo Vadis ? |
| 9:40 - 10:05 |
Session 3 ongoing: Metrology and Analytics
Session Chair: Jan Raebiger (GLOBALFOUNDRIES) |
| 9:40 - 10:05 |
3.7 |
Domenico Mello
(STMicroelectronics)
|
In-line, non destructive, and direct AlCu film thickness measurement by FIB in semiconductor manufacturing environment |
10:05 - 11:15 |
Session 5: Standard and Roadmaps
Session Chair: Martin Schellenberger (Fraunhofer IISB) |
| 10:05 - 10:30 |
5.1 |
Andreas Wittmaack
(GLOBALFOUNDRIES) |
Applied real-time data management using Interface A |
| 10:30 - 10:55 |
5.2 |
Gino Crispieri
(ISMI) |
Enhanced Equipment Quality Assurance (EEQA) |
| 10:55 - 11:15 |
Break |
| 11:15 - 12:30 |
Session 4: Fab-wide APC, Yield and "Multi-fab" Approaches, e-Diagnostics and e-Manufacturing
Session Chair: Lothar Pfitzner (Fraunhofer IISB) |
| 11:15 - 11:40 |
4.1 |
Ariel Greisas
(Intel) |
Innovative Dynamic Sampling for Die Impact Prediction |
| 11:40 - 12:05 |
4.2 |
Robert Barlovic
(GLOBALFOUNDRIES) |
Process Control Logistics (PCL) – An integrated extension to “Process Control” solutions |
| 12:05 - 12:30 |
4.3 |
James N D`Amour
(Intel) |
Yield Diagnostics of EOL failure signatures through modern statistical mapping to sparse spatial e-test patterns |
| 12:30 - 12:35 |
Closing Remarks |
| 12:35 - 13:45 |
Lunch Break |
| 1. Equipment and Process Fault Detection, Classification and Prediction |
| P101 |
Yochay Manoff
(Numonyx) |
Overcoming technology old generation through an advanced FDC System for SCP Wet Etch benches: From silent killer to real time alert |
| P102 |
Leonid Yarin
(Numonyx) |
Real time process monitoring: Solutions for non wafer based Advanced Process Control and predictive maintenance |
| P103 |
Dietmar Gleispach
(austriamicrosystems) |
Scheduling of foreline maintenance on a CVD tool based on FDC parameter |
| P104 |
Matthias Hänisch
(X-Fab Dresden) |
Implanter beam profile analysis |
| P105 |
Volodymyr Vasyutynskyy
(Dresden University of Technology) |
Using SECS/GEM Logs for Analyzing Internal Transport Processes in Semiconductor Equipment |
| P106 |
Dennis Föh
(Micronas) |
Deployment of Plasma Parameters for FDC in Metal Etch |
| P107 |
Ulrich Schoepka
(Fraunhofer IISB) |
In-line Target Erosion Measurement for Singulus TIMARIS Sputtering Tool |
| P108 |
Michael Rettelbach
(Infineon) |
Automated Full Line Excursion Analysis using Time Resolved FDC with PAnaMA |
| P109 |
Carlo Bevilacqua
(Numonyx) |
Monotone signal filtering and prediction with application to dry etch predictive maintenance |
| P111 |
Giuseppe De Nicolao
(University of Pavia) |
A Multilevel Model based technique for Fault Detection in Dry Etch Chamber Matching |
| P113 |
Natalina Di Stefano
(STMicroelectronics) |
Ion Implanters Predictive Maintenance through FDC |
| P114 |
Matteo Galbiati
(Numonyx) |
FDC application in CVD area: real time gas flow monitor |
| P115 |
Daniel Kost
(GLOBALFOUNDRIES) |
A method of discriminating between real and false alarms using data quality metrics |
| P117 |
Davide Codegoni
(Numonyx)
|
Metal contamination in SOI material: detection and impact on gate oxide quality |
| P118 |
Amit Nadir, Elad Cohen
(Numonxy) |
Heater failure predicting by EP system on Vertron III Diffusion furnaces |
| P119 |
Caterina Genua
(STMicroelecronics) |
Equipment failure forecast in a semiconductor production line |
| 2. Data Management and Process Control |
| P201 |
Roberto Colombo
(Numonyx) |
APC - Feedback Run to Run for a dry etching process |
| P202 |
Georg Roeder
(Fraunhofer IISB) |
Application of optical emission spectroscopy during process development of plasma assisted nitridation of thin thermal silicon dioxide films |
| P203 |
Bert Müller
(AIS Automation) |
Strategies of equipment integration in the photovoltaic as basement for FAB wide MES and APC solutions |
| P204 |
Stefan Schindler
(austriamicrosystms) |
Using a Generic, Multivariate Model for Online Monitoring of a Plasma Etch Tool |
| P205 |
Michel Juge
(STMicroelectronics) |
Open-Source Statistics Platform for Mismatching Automatic Report |
| P206 |
Boyidi Ravi Kiran
(GLOBALFOUNDRIES) |
Multi-Input Single-Output (MISO) Model Based Run to Run PVD Controller |
| P207 |
Andrea Schirru
(University of Pavia) |
Process Control techniques for multivariate control and yield estimation for lithographic masks |
| P208 |
Christian Ernst
(emse) |
A KDD model to discover correlated parameters in semiconductor manufacturing processes |
| 3. Metrology and Analytics |
| P301 |
Ditza Auerbach
(Applied Materials) |
Enhanced Capture Rate for Haze Defects in Production Wafer Inspection |
| P302 |
Christophe Martin
(STMicroelectronics) |
POD and FOUP contamination analyzer: Study of Acids and Amines impact on Defectivity and Yield |
| P303 |
Irina Lazareva
(Fraunhofer IISB) |
Fast assessment of the surface quality in sub-micrometer range with wave front sensing method |
| P304 |
Domenico Mello
(STMicroelectronics) |
TiN CVD oxygen contamination monitoring by AES as standard process control in manufacturing environment |
| P305 |
Robert Muhr
(Infineon) |
3D Geometry Measurement of Silicon Wafers based on a Deflectometric Method |
| P306 |
Simone Pampuri
(Universita di Pavia) |
Virtual Metrology algorithms for semiconductor manufacturing |
| 4. Fab-wide APC, Yield and "Multi-fab" Approaches, e-Diagnostics and e-Manufacturing |
| P402 |
Georg. Roeder
(Fraunhofer IISB)
|
Architecture for the Integration of Virtual Metrology and Predictive Maintenance into Existing Fab Systems |
| 6. Academia Contributions, Future Needs and Opportunities |
| P602 |
Heeyeop Chae
(Sungkyunkwan University) |
Endpoint and Fault Detection Using Principal Component Analysis for SiO2 Plasma Etching Process |
