8:00 - 8:30 |
Registration for Tutorials |
| 8:30 - 12:30 |
Tutorials, Registration |
| 12:30 - 14:00 |
Lunch Break, Registration |
| 14:00 - 15:20 |
Opening Session |
| 14:00 - 14:10 |
O1 |
Opening Address |
|
| 14:10 - 14:30 |
W1 |
Welcome Address:
Maxine Fassberg
(Intel)
|
|
| 14:30 - 14:50 |
W2 |
Welcome Address:
Yarom Ariav
(Ministry of Finance Israel) |
|
| 14:50 - 15:20 |
K1 |
Keynote 1:
Brian Krzanich
(Intel)
|
APC at Intel, benefits fo the Industrie |
15:20 - 17:45 |
Session 1: Fab-wide APC, Yield and “Multi-fab” Approaches
Session Chair: Jan Raebiger (AMD) |
15:20 - 15:45 |
1.1 |
Israel Tirkel
(Ben-Gurion University) |
Integrative consideration of Yield and Cycle Time for in-line metrology inspection scheduling |
| 15:45 - 16:05 |
Break |
| 16:05 - 16:30 |
1.2 |
Robert Barlovic
(AMD) |
Improved process performance by linking control applications to the dispatching system |
| 16:30 - 16:55 |
1.3 |
Noam Reshef
(Ben Gurion University) |
Imperfect maintenance of partially observable heterogeneous machines |
| 16:55 - 17:20 |
1.4 |
Bert Mueller
(AIS Automation) |
Time synchronization - Lesson Learned of a commercial prototype |
| 17:20 - 17:45 |
1.5 |
Henry Harel
(SiAl Logistics) |
The use of toolset control data for individual tool maintenance optimization |
17:45 - 18:15 |
Poster and Exhibits Call |
| 18:15 - 21:30 |
Reception, Poster Session and Exhibits |
| 8:30 - 8:35 |
Opening Remarks |
| 8:35 - 9:05 |
K2 |
Keynote 2:
Bruce Sohn
(First Solar)
|
Thin Film Technology for Creating Clean, Affordable Solar Electricity |
9:05 - 11:15 |
Session 2: Equipment and Process Fault Detection, Classification and Prediction
Session Chair: Joern Maeritz (Infineon) |
9:05 - 9:30 |
2.1 |
Oded Margalit
(IBM) |
Semi-Automatic Detection of Tool Variability |
| 9:30 - 9:55 |
2.2 |
Gottfried Gillich
(MKS Instruments) |
Process Drift Recognition and Solutions |
| 9:55 - 10:20 |
2.3 |
Yigal Tomer
(InnerSense) |
Smart Test Wafer for troubleshooting monitoring and predicting Wafer Handling Problems |
| 10:20 - 10:50 |
Break |
| 10:50 - 11:15 |
I.1 |
Invited:
Georg Kelm
(European Comission) |
EU FP7 Programme |
| 11:15 - 14:15 |
Session 3: Standard and Roadmaps, Future Needs and Opportunities
Session Chair: Brad van Eck (ISMI) |
| 11:15 - 11:40 |
3.1 |
Toshihiko Osada
(Fujitsu)
|
Jeita 300mmPrime Guideline |
| 11:40 - 12:05 |
3.2 |
Bill Ramus
(ILS Technology) |
Security & Interface C Use Cases: Review of Remote Access Applications |
| 12:05 - 12:30 |
3.3 |
James Moyne
(Applied Materials) |
Providing APC Input to the Factory Integration Chapter of the International Technology Roadmap for Semiconductors (ITRS) |
| 12:30 - 13:50 |
Lunch Break |
| 13:50 - 14:15 |
I.2 |
Invited:
Kumud Srinivasan
(Intel) |
Enabling Intel's Research-Development |
| 14:15 - 17:30 |
Session 4: Data Management and Process Control
Session Chairs: Part 1: Joern Maeritz (Infineon), Part 2: Johann W. Bartha (Technische Universität Dresden) |
| 14:15 - 14:40 |
4.1 |
Gottfried Gillich
(MKS Instruments) |
SECS Throttling |
| 14:40 - 15:05 |
4.2 |
Dirk Gleitsmann
(AMD) |
BEoL etch RtR control – an approach with a global model |
| 15:05 - 15:30 |
4.3 |
Gerhard Spitzlsperger
(Renesas) |
Recursive least square approach to improve the high product mix overlay R2R control issue |
| 15:30 - 15:55 |
Break |
| 15:55 - 16:20 |
4.4 |
André Horn
(Infineon) |
All-embracing Run-to-Run strategy on an example |
| 16:20 - 16:45 |
4.5 |
Paolo Amato
(STMicroelectronics) |
HELOTS: A Multivariate Visualization Methodology for Identifying Issues in Semiconductor Technology |
| 16:45 - 17:10 |
4.6 |
Thomas Kreutzmann
(AMD) |
Sophisticated algorithms used in the area of defect pattern recognition on Wafers |
| 17:10 - 17:30 |
S1 |
Special:
Brad van Eck (ISMI)
Toshihiko Osada (Fujitsu) |
Highlights from the recent AEC/APC Conferences in the US and Asia |
17:30 - 18:00 |
Break |
| 18:00 - 18:50 |
Bus transfer to dinner |
| 18:50 - 21:00 |
Conference dinner |
| 21:00 - 21:30 |
Bus transfer back from dinner |
| 8:30 - 8:35 |
Opening Remarks |
| 8:35 - 10:45 |
Session 5: Equipment and Process Fault Detection, Classification and Prediction
Session Chair: Gerhard Spitzlsperger (Renesas) |
| 8:35 - 9:00 |
I.3 |
Invited:
Michael Liehr
(IBM)
|
Successful Internation Collaboration - Fab Synchronization |
9:00 - 9:25 |
5.1 |
Eugene Tuv
(Intel) |
Fault Diagnosis with Supervised Learning |
| 9:25 - 9:50 |
5.2 |
Shai Haimson
(Intel) |
From TD to HVM - FDC usage |
| 9:50 - 10:20 |
K.3 |
Keynote 3
Ofer Greenberger
(KLA Tencor) |
APC and metrology |
| 10:20 - 10:45 |
Break |
| 10:45 - 15:10 |
Session 6: Metrology and Analytics
Session Chair: Gerald Elder (Intel) |
| 10:45 - 11:05 |
6.1 |
Menachem Shoval
(Intel) |
Integrated Metrology: Why won't it fly ? |
| 11:05 - 11:30 |
6.2 |
Gaurav Agrawal
(Spansion) |
Recursive analysis approach in Virtual Metrology |
| 11:30 - 11:55 |
6.3 |
Michal Rosen-Zvi
(IBM) |
Learning with Bayesian networks from in-line metrology sampling data |
| 11:55 - 12:20 |
6.4 |
Alexander Tokar
(Jordan Valley Semiconductors) |
Wafer Level Packaging process control by a fast micro-spot XRF technique |
| 12:20 - 14:00 |
Lunch Break
|
| 14:00 - 14:25 |
6.5 |
David Scheiner
(Nova) |
The Evolution of Integrated Process Control |
| 14:25 - 15:45 |
Session 7: Paneel Discussion |
| 15:45 - 16:00 |
Closing Remarks |
| 16:00 - 18:30 |
Happy Hour |
| Fab-wide APC, Yield and “Multi-fab” Approaches |
| P101 |
Bert Mueller
(AIS Automation) |
EES Data Framework based on Interface A |
| P103 |
Jérôme Besnard et al.
(PDF Solutions) |
Yield Aware Process Control Solutions |
| Equipment and Process Fault Detection, Classification and Prediction |
| P201 |
Giuseppe Fazio
(ST Microelectronics) |
Broken gates effect on batch implanters: FDC applications to reduce wafers scraps |
| P202 |
Daniele Villa
(ST Microelectronics) |
Improve the FDC application in Wet and Metal area |
| P204 |
Oded Berkooz
(Pronetix) |
The Virtual Reactor Kernel, based on the Low Dimensional Expandable Modeling method, enables time & efforts reduction throughout the life time of a process, and enables the single test wafer procedure for fault diagnostics |
| P205 |
Randy Heckman
(Advanced Energy) |
Predictive Diagnostics for Improved Reliability in Powered Plasma Processes |
| P206 |
Gottfried Gillich
(MKS Instruments) |
2nd GEN Multivariate Analysis Technology became Mainstreamby applying XML in and XML out |
| P207 |
Paul Sagues
(Berkeley Process Control) |
Configurable Input/Output System Provides High Speed Data Logging with Low Network Loading, Leading to Better, Lower Cost Predictive Maintenance |
| P208 |
Conley Amiad
(Applied Materials) |
APC for Haze Defects with Feed Forward Methodology between
Mask Inspection & Wafer Inspection tools |
| P209 |
Barry Coonan
(Straatum) |
Real Time Monitoring of a Ti Deposition ..... |
| P210 |
Dan Kimmel, Beni Troib (Intel) |
CE! Methodology using high sampling frequency Fault Detection |
| Standard and Roadmaps, Future Needs and Opportunities |
| P301 |
Enna Altshuler
(Tower Semiconductor) |
Design Hot Spot analysis using Automatic Physical Extractor |
| P302 |
Uwe Kramer
(Qimonda) |
CD-SEM Contour Based Process Monitoring |
| P304 |
Gino Crispieri
(ISMI) |
Metadata Guidance for Optimal Data Collection and Process Control |
| P306 |
Martin Eisfeld
(Technische Universität Dresden) |
Interface A in a productive environment |
| Data Management and Process Control |
| P401 |
Annemarie Schroeder-Heber
(Fraunhofer Institute IISB) |
Control and optimization of Ru deposition by pulsed MOCVD using mass spectroscopy measurements |
| P405 |
Mike Adel
(KLA Tencor) |
Elements of a production worthy high order overlay control solution |
| P406 |
Andrea Laurenzi
(Micron) |
A R2R controller for short-run within a Common Trend Model |
| P407 |
Andrea Vinci
(STMicroelectronics) |
Integration of a scatterometer into a dry etching tool to implement a feed-forward process control |
| Metrology and Analytics |
| P601 |
Dennis Bonciolini
(CyberOptics Semiconductor) |
Improving Tool Repeatability, Process Control and Predictive Maintenance Using Precision |
| P602 |
Vladislav Kaplan
(Intel) |
Resolution monitor application as effective and simple measure of CDSEM tool performance |
| P604 |
Matteo Galbiati
(STMicroelectronics) |
A simple model to implement process control based on temperature measure in DCVD area |
| P605 |
Meir Teichner
(PML-Particle Monitoring Technologies) |
Nanoscale size analysis by singular beam microscopy |
| P606 |
Michael Neel
(Inficon) |
High Speed RF Arc Detection and Remote Plasma Clean Endpoint |
| P607 |
Hagai Cohen
(Chemical Research Support, Weizmann Institute of Science) |
Non Contact Electrical Characterization of Sub-Surface Dielectric Layers |
| P608 |
Udi Efrat
(Camtek) |
Probe Mark Insection for Zero-Defect Automotice Devices |
| P609 |
Ira Naot
(Tevet PCT) |
IMM as an Advanced Sensor in Semiconductor Manufacturing Process-Control |
| P610 |
Laurent Karsenti
(Applied Materials) |
Litho Qualification & Monitoring based on Design Based Binning Analysis after Develop Inspection |
| P611 |
Michael Klick (Plasmetrex)
|
Virtual Metrology using Advanced Plasma Sensor and Multivariate Model for Etch Rate Prediction |
