Scope of the Conference
This Conference in 2010 in Catania will review recent technical advancements in order to assure alignment with the needs of integrated circuit manufacturers, the solar and flat-paneel manufacturers, equipment suppliers, software providers, as well as sensor and metrology suppliers. It will also review new and upcoming SEMI standards and foster consistency with the International Technology Roadmap for Semiconductors.
Session Topics
We appreciate input from semiconductor industry as well as from solar and flat panel display manufacturing !
1. Equipment and Process Fault Detection, Classification and Prediction
Includes: Fault detection and classification, analysis and prediction, fault models, defect management, environmental impacts, control of faciilities
2. Data Management and Process Control
Includes: Data mining, real-time data, data compression, run-to-run/wafer-to-wafer control, process models, model-based control
3. Metrology and Analytics
Includes: Sensors and measurement tools, virtual metrology, sensor calibration and matching, calibration materials and procedures, standard interfaces integration of metrology and analytics in production (hardware/software), intelligent sensors (self calibration, self diagnostics)
4. Fab-wide APC, Yield and "Multi-fab" Approaches, e-Diagnostics and e-Manufacturing
Includes: High volume vs. modular fabs, cost modeling and cost reduction, benefits and justification (RoI, CoO, OEE), productivity analysis, data mining of defect densities and PCM, yield improvement, yield models and usage in APC environment, usage of APC data for yield prediction and correlation, technology & process transfer incl. APC, systems communality, fab clusters & foundry business aspects, IP considerations
5. Standard and Roadmaps
Includes: Roadmaps (e.g., ITRS), application of standards (e.g., DDA, PCS), process control capabilities
6. Academia Contributions, Future Needs and Opportunities
Includes: Linking APC with design-for-manufacturability (DFM), use of inputs about process variability for the design process, use of inputs from the design process for acceptable process variability, utilization of APC infrastructure for supply chain management, opportunities for APC for incoming material control, opportunities for enhanced control of facilities
About the European AEC/APC Conference
The conference is held annually by the european semiconductor industry in the interest of the semiconductor industry in Europe and worldwide.
It is coordinated with the annual Sematech AEC/APC Symposium in America and Asia and Semicon Europe and takes place at centers of the semiconductor industry in Europe.
The conference is organised by Silicon Saxony, a member of European Semiconductor Networks, and hosted locally. It is self-financed by conference fee and sponsoring.
The conference is supported by institutes and universities, for example by the Fraunhofer Institut Integrierte Systeme und Bauelementetechnologie and the University of Dresden.
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The 10th European AEC/APC Conference will take place at Catania in April 2010 and is hosted by STMicroelectronics and Numonyx.
Conference Locations
The European AEC/APC Conference takes place at the most important centers of the european semiconductor industry. Have a look at the European AEC/APC Conference Cities so far.
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Aix-en-Provence
Center of the semiconductor industry in South of France -
Conference Location in 2006 |
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Dresden
Center of the semiconductor industry in Germany -
Conference Location in 2000, 2001, 2002, 2004 and 2007 |
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Dublin
Center of the semiconductor industry in Ireland -
Conference Location in 2005 |
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Grenoble
Center of the semiconductor industry in France -
Conference Location in 2003 |
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Tel-Aviv
Center of the semiconductor industry in Israel -
Conference Location in 2008 |
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Steering Committee
Johann W. Bartha, University of Dresden (Germany)
Brad Van Eck, International Sematech, Austin (USA)
Giuseppe Fazio, Numonyx, Agrate (Italy)
Roberto Forzese, STMicroelectronics, Catania (Italy)
Joost van Herk, NXP, Crolles (France)
Stephane Hubac, STMicroelectronics, Crolles (France)
Ari Komeran, Intel (Israel)
Andreas Kyek, Infineon Technologies, Regensburg (Germany)
Lutz Labs, Infineon Technologies, Dresden (Germany)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Jan Raebiger, Globalfoundries, Dresden (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Andreas Steinbach, VON ARDENNE Anlagentechnik GmbH, Dresden (Germany)
Giuseppe Vento, STMicroelectronics, Catania (Italy)
Program Committee
Johann W. Bartha, University of Dresden (Germany)
Almuth Behrisch, Infineon Technologies, Regensburg (Germany)
Ralf-Peter Brinkmann, University of Bochum (Germany)
Jean Pierre Crest, STMicroelectronics, (France)
Gerald Elder, Intel, Albuquerque (USA)
Giuseppe Fazio, Numonyx, Agrate (Italy)
Declan Melody, Intel, Dublin (Ireland)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Wolfgang Ploss, Texas Instruments, Freising (Germany)
Jan Raebiger, Globalfoundries, Dresden (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Andreas Steinbach, VON ARDENNE Anlagentechnik GmbH, Dresden (Germany)
Organization Committee
Gitta Haupold, Silicon Saxony, Dresden (Germany)
Klaus Rehak, Silicon Saxony, Dresden (Germany)
Andreas Steinbach, VON ARDENNE Anlagentechnik GmbH, Dresden (Germany)
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Contact
Gitta Haupold
haupold(at)aecapc-europe.com
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