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Key aspect of this years conference:
"From reactive to predictive - from SPC to model-based process control"
Welcome Addresses
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Dirk Hilbert
Deputy Mayor and Head of Department of Economic Development
(City of Dresden) |
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Pantelis Haidas
Managing Director
(Infineon Technologies Dresden) |
Keynotes
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James Moyne
Associate Research Scientist, Mechanical Engineering
(Univ. Michigan)
International Technology Roadmap for Semiconductors (ITRS) Factory Integration Major Revisions for 2013 |
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Martin Heerschop
Sales Director
(Solutions on Silicon BV)
Factory innovation through secondary equipment applications |
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Jeff Dietz
Program Manager Controller Systems
(Applied Materials)
Extension of 200mm equipment life time and fast data collection capabilities by new controller system for legacy systems |
The European APCM Conference sessions are built around of following topics
Advanced Process Control
on Unit Process Level
- APC applications at Unit Processes
Plasma processes (PVD, PECVD, plasma etch, P3I), Thermal processes (CVD, e-beam, i-beam, evaporation, doping, epitaxy, diffusion, RTP), Wet processes (clean, etch, electro- and electroless plating), Metrology (films, defect density, in line and large area metrology), Lithography (track, exposure tool), Implant, CMP, Backend
- Unit process control methods
Fault detection and classification (FDC) and fault prediction (FP), Run-to-Run Control (R2R), large area uniformity, unit process development and transfer
- Tool and sensor data analysis
Sensor implementation and integration, data collection, aggregation, classification and quality, assigning of logistical data, statistical approaches and non-statistical measures
- Maintenance & tool optimization
Preventive maintenance, condition-based maintenance, predictive maintenance, tool improvements, spare parts assessment and qualification, conditioning and first wafer effects, chamber matching
- Enhanced Equipment Quality Assurance (EEQA) Physical and chemical unit process models and model-based sensors, methods to ensure component functionality, reliability, performance and traceability, Equipment Health Monitoring (EHM)
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Advanced Process Control
on Fab Level
- Fab level process control methods
Run-to-Run and Wafer-to-Wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy
- Virtual metrology
Application of process models, control density improvement, reduction of measurement operations and non-product wafers, throughput increase
- Yield management
Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management
- Factory data analysis
Real-time data collection aggregation, classification and quality, process and equipment capability, mathematical methods and model creation, novel methods of data visualization and data analysis
- IT infrastructure
Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards
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Manufacturing Effectiveness
and Productivity
- Unit process & equipment productivity
Throughput and uptime improvement, cycle time and variability reduction, non-productive wafer and substrate reduction, tool and unit process related productivity improvement
- Factory productivity and automation
Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation-related productivity improvement, master data management, Material tracking of materials, spare parts and consumables, production control
- Factory modeling, simulation and optimization
Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization
- Cost optimisation and end-of-life equipment issues
Fixed and variable cost reduction, Cost of Ownership (CoO) and Overall Equipment Efficiency (OEE), unit cost modelling, equipment and maintenance optimization
- Environment and Green Manufacturing
Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation, lean manufacturing
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About the European APCM Conference
The European Advanced Process Control and Manufacturing (APCM) Conference is directed to manufacturers, suppliers and scientific community of semiconductor, photovoltaic, LED, flat panel, MEMS, and other related industries.
The topics are focused on current challenges and future needs of Advanced Process Control and Manufacturing Effectiveness.
The conference takes place at centers of the semiconductor
and photovoltaic industry in Europe annually. It is coordinated with the Sematech AEC/APC Symposium
in America and Asia and Semicon Europe.
The conference is organised by Silicon Saxony,
a member of European Semiconductor Networks, and hosted locally.
The conference is self-financed by fees and sponsoring.
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Dresden
2000, 2001, 2002, 2004, 2007, 2011 |
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Join our Contact List
Please add yourself to our contact list in order to receive information about future APCM Conference activities and events, more ...
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Program Committee
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Johann W. Bartha, Germany |
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Brigitte Calzi, France |
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Gino Crispieri, USA |
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Giuseppe Fazio, Italia |
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Gerd Fischer, Germany |
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Dennis Föh, Germany |
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Onno Gabriel, Germany |
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Christoph Hohle, Germany |
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Ronald Hoyer, Germany |
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Klaus Kabitzsch, Germany
Program Committee Speaker |
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Michael Klick, Germany |
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Frédéric Lafaye de Micheaux, France |
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Niall Macgearailt, Ireland |
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Robert McCafferty, USA |
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James Moyne, USA |
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Thomas Müller, Gemany |
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Ute Nehring, Germany |
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Jan Räbiger, Germany |
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Gerald Rampf, Germany |
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Michael Rettelbach, Germany |
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Franck Savalle, France |
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Martin Schellenberger, Germany |
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Eckhard Schöbel, Germany |
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Holger Schwekendiek, Germany |
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Denis Shamiryan, Germany |
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Deepak Sharma, USA |
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Andreas Steinbach, Germany |
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Sam Tal, Israel |
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Alfred Vater, Germany |
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Alan Weber, USA |
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Roland Willmann, Austria |
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Thomas Zwack, Germany |
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Home
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Contact
Rene Weber
weber@apcm-europe.eu
phone +49 351 8925-887
fax +49 351 8925-889 |
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