Prime Sponsors

STM

Numonyx


Sponsors

Cyberoptics


Hosted and organized in Catania by

STM

Numonyx

Organized
by
Silicon Syxony

University of Dresden

Fraunhofer Institute IIS-B

Intel

AMD

Infineon

Atmel

NXP

Freescale

International Sematech

Semi


Exhibitors
and Sponsors
are welcome

 

10th European Advanced Equipment Control/
Advanced Process Control (AEC/APC) Conference
Hotel Sheraton Catania, Sicily - Italy, April 21 - 23,
2010


Home >>> Last Update: May, 25 by andreas.steinbach(at)aecapc-europe.com

Prime
Sponsors
STMicroelectronics
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Numonyx

Sponsors
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Cyberoptics
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Mount Atna

10th European AECAPC Conference is postponed to April 2010
The recent economy crisis is taking a toll from everyone, the semiconductor industry is not excluded and it seems that the level of impact just continues to evolve.
It is in our responsibility at the AEC/APC conference, to carefully assess the situation in case the economy crisis continues or even gets worse.
To save costs, most companies have severe travel restrictions currently. To have a conference like the years before with an appropriate number of interesting presentations and a lot of talks and contacts,
the Steering Committee has decided to shift the 10th AEC/APC Conference to 2010.

The 10th European AECAPC Conference will take place at Catania on April 21 - 23, 2010.


Important Dates
September 2009, First Call fo Papers


Session Topics

This conference 2010 in Catania will review recent technical advancements in order to assure alignment with the needs of integrated circuit manufacturers, semiconductor equipment suppliers, software, sensor, and metrology suppliers. It will also review SEMI standards and consistency with the International Technology Roadmap for Semiconductors.

Equipment and Process Fault Detection, Classification and Prediction
Includes: Fault detection and classification, analysis and prediction, fault models, defect management, environmental impacts, control of faciilities

Data Management and Process Control
Includes: Data mining, real-time data, data compression, run-to-run / wafer-to-wafer control, process models, model-based control
Metrology and Analytics

Includes: Sensors and measurement tools, virtual metrology, sensor calibration and matching, calibration materials and procedures, standard interfaces integration of metrology and analytics in production (hardware / software), intelligent sensors (self calibration, self diagnostics)

Fab-wide APC, Yield and "Multi-fab" Approaches, e-Diagnostics and e-Manufacturing
Includes: High volume vs. modular fabs, cost modeling and cost reduction, benefits and justification (RoI, CoO, OEE), productivity analysis, data mining of defect densities and PCM, yield improvement, yield models and usage in APC environment, usage of APC data for yield prediction and correlation, technology & process transfer incl. APC, systems communality, fab clusters & foundry business aspects, IP considerations

Standard and Roadmaps
Includes:Roadmaps (e.g., ITRS), application of standards (e.g., DDA, PCS), process control capabilities

Academia Contributions, Future Needs and Opportunities
Includes: Linking APC with design-for-manufacturability (DFM), use of inputs about process variability for the design process, use of inputs from the design process for acceptable process variability, utilization of APC infrastructure for supply chain management, opportunities for APC for incoming material control, opportunities for enhanced control of facilities

With the recent solar and flat panel display technology and manufacturing, the conference decided this year to welcome this industry as well.
In addition, we plan to have a workshop-like session with technical details, dedicated to the engineers in the line.


Flyer

About the European AEC/APC Conference

The conference is held annually by the european semiconductor industry in the interest of the semiconductor industry in Europe and worldwide.
It is coordinated with the annual Sematech AEC/APC Symposium in America and Asia and Semicon Europe and takes place at centers of the semiconductor industry in Europe.
The conference is organised by Silicon Saxony, a member of European Semiconductor Networks, and hosted locally. It is self-financed by conference fee and sponsoring.
The conference is supported by institutes and universities, for example by the Fraunhofer Institut Integrierte Systeme und Bauelementetechnologie and the University of Dresden.
.
The 10th European AEC/APC Conference will take place at Catania in April 2010 and is hosted by STMicroelectronics and Numonyx.

Download the conference flyer 2010 diskette

Conference Locations
The European AEC/APC Conference takes place at the most important centers of the european semiconductor industry. Have a look at the European AEC/APC Conference Cities so far.

Aix-en-Provence Aix-en-Provence
Center of the semiconductor industry in South of France -
Conference Location in 2006
Dresden
Center of the semiconductor industry in Germany -
Conference Location in 2000, 2001, 2002, 2004 and 2007
Dublin
Center of the semiconductor industry in Ireland -
Conference Location in 2005
Grenoble
Center of the semiconductor industry in France -
Conference Location in 2003
Tel-Aviv
Tel-Aviv
Center of the semiconductor industry in Israel -
Conference Location in 2008

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Steering Committee
Johann W. Bartha, University of Dresden (Germany)
Thomas dePaly, Advanced Micro Devices, Dresden (Germany)
Brad Van Eck, International Sematech, Austin (USA)
Giuseppe Fazio, Numonyx, Agrate (Italy)
Roberto Forzese, STMicroelectronics, Catania (Italy)
Joost van Herk, NXP, Crolles (France)
Stephane Hubac, STMicroelectronics, Crolles (France)
Ari Komeran, Intel (Israel)
Andreas Kyek, Infineon Technologies, Regensburg (Germany)
Lutz Labs, Infineon Technologies, Dresden (Germany)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Andreas Steinbach, Silicon Saxony, Dresden, Germany
Giuseppe Vento, STMicroelectronics, Catania (Italy)

Program Committee
Richard Babikian, Dublin (Ireland)
Johann W. Bartha, University of Dresden (Germany)
Almuth Behrisch, Infineon Technologies, Regensburg (Germany)
Ralf-Peter Brinkmann, University of Bochum (Germany)
Gerald Elder, Intel, Albuquerque (USA)
Giuseppe Fazio, Numonyx, Agrate (Italy)
Joost van Herk, NXP, Crolles (France)
Stephane Hubac, STMicroelectronics, Crolles (France)
Declan Melody, Intel, Dublin (Ireland)
Toshihiko Osada, Fujitsu (Japan)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Wolfgang Ploss, Texas Instruments, Freising (Germany)
Jan Raebiger, Advanced Micro Devices, Dresden (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Andreas Steinbach, Silicon Saxony, Dresden (Germany)

Organization Committee
Gitta Haupold, Silicon Saxony, Dresden (Germany)
Klaus Rehak, Silicon Saxony, Dresden (Germany)

Andreas Steinbach, Silicon Saxony, Dresden (Germany)


Contact
Gitta Haupold
haupold(at)aecapc-europe.com