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Announcement of the 10th European AEC/APC Conference
Dear Colleagues,
please mark your calendar for the next hot spot…
10th European AEC-APC Conference
Wed 22nd – Fri 24th,
April 2009 at
Catania,
Sicily (Italy)
For a first impression please download the announcement presentation: 
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Welcome Address
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Maxine Fassberg
(Intel)
Vice President, Technology and Manufacturing Group
Fab 28 Plant Manager
General Manager, Intel Israel
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Keynotes
Invited Talks
Session Topics
Equipment and Process Fault Detection, Classification and Prediction
Includes: Fault detection and classification, analysis and prediction, fault models, defect management, environmental impacts, control of facilities
Data Management and Process Control
Includes: Data mining, real-time data, data compression, run-to-run / wafer-to-wafer control, process models, model-based control
Metrology and Analytics
Includes: Sensors and measurement tools, virtual metrology, sensor calibration and matching, calibration materials and procedures, standard interfaces integration of metrology and analytics in production (hardware / software), intelligent sensors (self calibration, self diagnostics)
Fab-wide APC, Yield and “Multi-fab” Approaches
Includes: High volume vs. modular fabs, cost modelling and cost reduction, benefits and justification (RoI, CoO, OEE), productivity analysis, data mining of defect densities and PCM, yield improvement, yield models and usage in APC environment, usage of APC data for yield prediction and correlation, technology & process transfer incl. APC, systems communality, fab clusters & foundry business aspects, IP considerations
Standard and Roadmaps
Includes:Roadmaps (e.g., ITRS), application of standards (e.g., DDA, PCS), process control capabilities
Future Needs and Opportunities
Includes: Linking APC with design-for-manufacturability (DFM), use of inputs about process variability for the design process, use of inputs from the design process for acceptable process variability, utilization of APC infrastructure for supply chain management, opportunities for APC for incoming material control, opportunities for enhanced control of facilities
About the European AEC/APC Conference
The conference is held annually by the european semiconductor industry in the interest of the semiconductor industry in Europe and worldwide.
It is coordinated with the annual Sematech AEC/APC Symposium in America and Asia and Semicon Europe and takes place at centers of the semiconductor industry in Europe.
The conference is organised by Silicon Saxony, a member of European Semiconductor Networks, and hosted locally. It is self-financed by conference fee and sponsoring.
The conference is supported by institutes and universities, for example by the Fraunhofer Institut Integrierte Systeme und Bauelementetechnologie and the University of Dresden.
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This years conference will take place in Tel-Aviv in March 2008 and is hosted by Intel. It will be Co-Chaired by Ari Komeran (Intel).and Lothar Pfitzner (Fraunhofer IISB).
Conference Locations
The European AEC/APC Conference takes place at the most important centers of the european semiconductor industry. Have a look at the European AEC/APC Conference Cities so far.
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Aix-en-Provence
Center of the semiconductor industry in South of France -
Conference City in 2006 |
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Dresden
Center of the semiconductor industry in Germany -
Conference City in 2000, 2001, 2002, 2004 and 2007 |
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Dublin
Center of the semiconductor industry in Ireland -
Conference City in 2005 |
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Grenoble
Center of the semiconductor industry in France -
Conference City in 2003 |
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Tel-Aviv
Center of the semiconductor industry in Israel -
Conference City in 2008 |
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Steering Committee
Johann W. Bartha, University of Dresden (Germany)
Patrick Cogez, STMicroelectronics, Crolles (France)
Thomas dePaly, Advanced Micro Devices, Dresden (Germany)
Brad Van Eck, International Sematech, Austin (USA)
Joost van Herk, Philips, Crolles (France)
Ari Komeran, Intel (Israel)
Lutz Labs, Infineon Technologies, Dresden (Germany)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Jens Zimmermann, Qimonda, Dresden (Germany)
Program Committee
Richard Babikian, Dublin (Ireland)
Johann W. Bartha, University of Dresden (Germany)
Ralf-Peter Brinkmann, University of Bochum (Germany)
Patrick Cogez, STMicroelectronics, Crolles (France)
Gerald Elder, Intel, Albuquerque (USA)
Joost van Herk, Philips, Crolles (France)
Eckhard Marx, Qimonda, Dresden (Germany)
Joern Maeritz, Infineon Technologies, Regensburg (Germany)
Declan Melody, Intel, Dublin (Ireland)
Toshihiko Osada, Fujitsu (Japan)
Lothar Pfitzner, Fraunhofer Institute IISB, Erlangen (Germany)
Wolfgang Ploss, Texas Instruments, Freising (Germany)
Martin Schellenberger, Fraunhofer Institute IISB, Erlangen (Germany)
Jan Raebiger, Advanced Micro Devices, Dresden (Germany)
Organization Committee
Gitta Haupold, Silicon Saxony e.V., Dresden (Germany)
Klaus Rehak, Silicon Saxony e.V., Berlin (Germany)
Andreas Steinbach, Qimonda, Dresden (Germany)
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Contact
Gitta Haupold
haupold@aecapc-europe.com
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