APCM Europe

Organization

Silicon Saxony


Prime Sponsors

Global Foundries

Infineon


Contributors

AIS Automation

ZNT


Media Partner

Wirtschaftsjournal

Dresden

13th European Advanced Process Control and Manufacturing Conference
Hilton Dresden, April 15-17, 2013


Key aspect of this years conference:
"From reactive to predictive - from SPC to model-based process control
"

Prime Sponsors

Global Foundries

Infineon

Contributors

AIS Automation

ZNT

 

News Last update April 14


Welcome, nice to meet you at the conference !

 

Links and Downloads


Online Registration

Exhibitor Information

Sponsor Information


Welcome Addresses

Dirk Hilbert

Pantelis Haidas

Dirk Hilbert

Deputy Mayor and Head of Department of Economic Development
(City of Dresden
)

 

Pantelis Haidas

Managing Director
(Infineon Technologies Dresden)


Keynotes

Olaf Herzog

Christian Esser

 

 

Michael Benndorf

Olaf Herzog

Director Manufacturing Systems and Solutions
(GLOBALFOUNDRIES Dresden)

 

Christian Esser

VP Technology
(Infineon Technologies Dresden)

 

Michael Benndorf

Department Manager Lithography
(X-FAB Dresden)


Invited Talks

James Moyne

Martin Heershop

  Jeff Dietz

James Moyne

Associate Research Scientist, Mechanical Engineering
(Univ. Michigan)

International Technology Roadmap for Semiconductors (ITRS) Factory Integration Major Revisions for 2013

 

Martin Heerschop

Sales Director
(Solutions on Silicon BV)

Factory innovation through secondary equipment applications

 

Jeff Dietz

Program Manager Controller Systems
(Applied Materials)

Extension of 200mm equipment life time and fast data collection capabilities by new controller system for legacy systems


The European APCM Conference sessions are built around of following topics

Advanced Process Control on Unit Process Level

  • APC applications at Unit Processes
    Plasma processes (PVD, PECVD, plasma etch, P3I), Thermal processes (CVD, e-beam, i-beam, evaporation, doping, epitaxy, diffusion, RTP), Wet processes (clean, etch, electro- and electroless plating), Metrology (films, defect density, in line and large area metrology), Lithography (track, exposure tool), Implant, CMP, Backend
  • Unit process control methods
    Fault detection and classification (FDC) and fault prediction (FP), Run-to-Run Control (R2R), large area uniformity, unit process development and transfer
  • Tool and sensor data analysis
    Sensor implementation and integration, data collection, aggregation, classification and quality, assigning of logistical data, statistical approaches and non-statistical measures
  • Maintenance & tool optimization
    Preventive maintenance, condition-based maintenance, predictive maintenance, tool improvements, spare parts assessment and qualification, conditioning and first wafer effects, chamber matching
  • Enhanced Equipment Quality Assurance (EEQA) Physical and chemical unit process models and model-based sensors, methods to ensure component functionality, reliability, performance and traceability, Equipment Health Monitoring (EHM)

Advanced Process Control on Fab Level

  • Fab level process control methods
    Run-to-Run and Wafer-to-Wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy
  • Virtual metrology
    Application of process models, control density improvement, reduction of measurement operations and non-product wafers, throughput increase
  • Yield management
    Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management
  • Factory data analysis
    Real-time data collection aggregation, classification and quality, process and equipment capability, mathematical methods and model creation, novel methods of data visualization and data analysis
  • IT infrastructure
    Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards

 

 

Manufacturing Effectiveness and Productivity

  • Unit process & equipment productivity
    Throughput and uptime improvement, cycle time and variability reduction, non-productive wafer and substrate reduction, tool and unit process related productivity improvement
  • Factory productivity and automation
    Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation-related productivity improvement, master data management, Material tracking of materials, spare parts and consumables, production control
  • Factory modeling, simulation and optimization
    Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization
  • Cost optimisation and end-of-life equipment issues
    Fixed and variable cost reduction, Cost of Ownership (CoO) and Overall Equipment Efficiency (OEE), unit cost modelling, equipment and maintenance optimization
  • Environment and Green Manufacturing
    Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation, lean manufacturing

About the European APCM Conference

The European Advanced Process Control and Manufacturing (APCM) Conference is directed to manufacturers, suppliers and scientific community of semiconductor, photovoltaic, LED, flat panel, MEMS, and other related industries. The topics are focused on current challenges and future needs of Advanced Process Control and Manufacturing Effectiveness.

The conference takes place at centers of the semiconductor and photovoltaic industry in Europe annually. It is coordinated with the Sematech AEC/APC Symposium in America and Asia and Semicon Europe.

The conference is organised by Silicon Saxony, a member of European Semiconductor Networks, and hosted locally. The conference is self-financed by fees and sponsoring.

Aix-en-Provence
Aix-en-Provence 2006
Sicily
Catania 2010
Dresden 2000, 2001, 2002, 2004, 2007, 2011
Dublin
Dublin 2005
Grenoble
Grenoble 2003, 2012
Tel-Aviv
Tel-Aviv 2008

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Program Committee

TU Dresden
 

Johann W. Bartha, Germany

STMicroelectronics
  Brigitte Calzi, France
Sematech
  Gino Crispieri, USA
Micron
  Giuseppe Fazio, Italia
Solarworld
  Gerd Fischer, Germany
Micronas
  Dennis Föh, Germany
pvcomb
  Onno Gabriel, Germany
Fraunhofer CNT
 

Christoph Hohle, Germany

RENA
  Ronald Hoyer, Germany
TU Dresden
  Klaus Kabitzsch, Germany
Program Committee Speaker
Plasmetrex
 

Michael Klick, Germany

PDF Solutions
 

Frédéric Lafaye de Micheaux, France

Intel
  Niall Macgearailt, Ireland
RHM Consulting
  Robert McCafferty, USA
Applied Materials
  James Moyne, USA
PeerGroup
  Thomas Müller, Gemany
Globalfoundries
  Ute Nehring, Germany
Globalfoundries
  Jan Räbiger, Germany
ZNT Richter
  Gerald Rampf, Germany
Infineon
  Michael Rettelbach, Germany
STMicroelectronics
  Franck Savalle, France
Fhg IISB
  Martin Schellenberger, Germany
AIS Automation
 

Eckhard Schöbel, Germany

Texas Instruments
  Holger Schwekendiek, Germany
Globalfoundries
  Denis Shamiryan, Germany
Applied Materials
  Deepak Sharma, USA
Von Ardenne
  Andreas Steinbach, Germany
Tadin Instruments

 

 

Sam Tal, Israel
Infineon
  Alfred Vater, Germany
Cimetrix
  Alan Weber, USA
acp-it
  Roland Willmann, Austria
Texas Instruments
 

Thomas Zwack, Germany


Home


Silicon Saxony

Mr. Rene Weber

Contact

Rene Weber
weber@apcm-europe.eu
phone +49 351 8925-887
fax +49 351 8925-889